The recent developed roll-to-roll equipment by MIRDC can be applied in the substrate with width of 300-600mm and thickness of 9-100μm. The design is applied in the substrate with width 0f 1200mm in the near future. The key technologies for the established flexible substrate coatings include the substrate surface modification/ treatment, tension control of the rolled materials, substrate cooling design, pressure drop pumping design and the design of the magnetron sputtering target sources to be applied in the continuous multi-layered thin films for the various targets. Additionally the equipment can install the self-developed surface modification modules to promote the performance of the coating film. In the product application, the plastics (PI, PET, etc.) or the metal rolling substrate materials are applicable with excellent performance. Various flexible film materials can be coated.
　　MIRDC has already established the capability for the manufacturing of the roll-to-roll equipment. It can reduce the purchasing costs more than 50% compared with the same type equipment purchased abroad. Currently, MIRDC actively cooperates with several domestic manufacturers and assists to upgrade the technical level of the 3C industries in Taiwan. In the meantime we apply the previous core technologies on the development of plasma thin film processing and equipment, including the surface plasma modification technology for flexible substrate, EMI coatings for mobile phone and notebook shell, copper film for flexible circuit board and the ITO coatings for touch control flat panel to provide the local manufacturers a complete set of the total solution for the manufacturing of the vacuum roll-to-roll sputtering equipment and to assist the local equipment manufacturers in developing toward the development of high value opto-electronics products industry.