由於近年來環保和再回收議題的盛行,可攜式電子產品構件的金屬化已是趨勢,如鋁、鎂等輕金屬材質就已經廣泛地使用在可攜式電子產品的構件或殼件上。為因應次世代可攜式電子產品的發展,新型式材質的應用與需求日益迫切,本計畫即是運用特殊板材,如不�袗�、鈦金屬等難成形材,以及不�袗�/鋁、鈦/鋁等雙層複合板,發展次世代具有特色之高質感金屬板材產品,並且利用板材液壓成形技術具有提高材料成形性、快速開發、簡化模具設計與成形道次、產品尺寸精度佳(回彈量小)及高表面品質等優點,以及藉由銲接技術的研發,解決後續雙層複合板與相關金屬鎖扣件之接合問題,將可提供業界完整的解決方案,並協助業者發展特殊金屬與複雜曲面或造型之高附加價值產品,以進一步帶動相關產品與產業朝向高值化方向發展。
Since environmental concern and recycling is prevalent, the
development of metallic structure parts for portable electronic
devices becomes the future focus. Accordingly Al and Mg metals
used to be extensively applied to structural components or casings
for such devices. The project pinpoints R&D of sheet metal
forming of particular materials, such as SUS, Ti, and SUS/Al,
Ti/Al clad metals, which may conform to the future demands from
new generation electronic devices. Besides we will also engage
in the development of sheet hydroforming technology, we expect
to enhance the material formability, reduce the forming stages,
make products with higher dimensional precision(small springback)
and excellent surface quality. Moreover welding technology is
to be investigated to solve the bonding problems between dissimilar
metals and its attached elements. The project execution can assist
the forming capabilities of particular metals and products with
3D complicated and curved shape. Additionally domestic related
industry can develop toward value-added heightening through those
technologies setup and introduction.