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2011年2月25日
第 103期
     
研發動向
透明導電膜沈積設備技術

  透明導電膜是近年來產業應用最多的材料,可以應用在FPD、觸控螢幕及太陽能電池等,這些產品未來將往前瞻之軟式結構發展,而可撓式之透明導電膜全賴捲式鍍膜設備之量產製造。透過透明導電膜沈積設備技術之開發將有助於降低設備成本投資40%以上,國內有多家業者投入電阻式觸控螢幕的透明導電膜的生產。

  本計畫主要開發OLED元件用的透明導電膜,其透明導電膜的特性需求遠高於觸控螢幕上的應用,不論阻抗與透光性的要求都較嚴苛,且需通過撓曲測試,始OLED能真正達到可撓的程度。

  Transparent conducting films are the most widely applied materials for industrial application in recent years which can be used in FPD、touch panel and solar cells. These products will move forward to the development of advanced flexible structure in the future while the mass production of the flexible transparent conducting thin film will be dependent on roll-to-roll (R2R) deposition equipment. The development of transparent conducting film deposition equipment technology will be benefit for the reduction of 40% equipment investment cost. Many domestic plants in Taiwan strive for the manufacturing of transparent conducting film for resistant type touch panel.

The main objective of this project will develop the transparent conducting films for OLED parts. The performance requirements for transparent conducting film are much more strict than the application for touch panel both for the resistance and transparency and the flexibility test is essential for the flexibility of the OLED products.


微接觸印刷於有機薄膜電晶體的印製技術
  近年來有機高分子的電子元件引起了極廣泛的注意,尤其是應用在有機薄膜電晶體的製作上。而要將此薄膜電晶體的圖案製作於基材上,特別是可大量生產的軟性基材上,微接觸印刷(Micro-Contact Printing)提供了既新又便宜的解決方案。微接觸印刷其概念與一般的印刷製程相似,以一個表面上刻有圖案的印模(stamp)將墨水分子(ink molecules)轉印到基板上,達到在基板上形成所需之圖案的目的。而與一般印刷製程的差異在於微接觸印刷可以達到轉印具有微米及奈米特徵的圖案。本計畫主要的兩項研究項目分別為:(1)單一軟性高分子薄膜電晶體全印刷製程實作與性能評估、以及(2)確認2x2 軟性高分子薄膜電晶體陣列全印刷製程解析度。第一項研究項目是在探討低溫製程物理吸附式軟性高分子薄膜電晶體層各層間的吸附條件;第二項研究項目擬藉由製作2x2 軟性高分子薄膜電晶體陣列來確認在保持高度3D 傳真度下,現階段可以達到之尺寸解析度,同時也藉此研究釐清執行多層印刷時對位的問題並提出解決方案。本計畫開發技術,將來更可延伸至在室溫下做大面積、捲對捲軟性基材的連續式印刷製程,用以製作高產能與低成本的全有機高分子的薄膜電晶體,及有機高分子的軟性主動陣列式OLEDs 顯示器。

  Organic and polymeric electronics applied on the organic thin film transistors (OTFTs) has attracted much attention in recent years. To pattern polymer thin film onto flexible substrates, micro-contact printing technique offers novel and inexpensive routes. In order to transfer the pattern, micro-contact printing would employ a patterned stamp as the master mold coated with the polymer ink to contact substrates, achieving the printing purpose which is similar to the normal printing process. Nevertheless, the only difference is micro-contact printing has the capability to pattern polymers with sub-micro and nanometer scale resolutions. This project has two major research items including: (1) the fabrication process and the property evaluation of single OTFTs which will probe the adhesive force between different printing layers based on cohesion work. (2) 2x2 array resolutions of OTFTs which will focus on the 3D fidelity dimensions and the multi-layers printing positioning to find out the resolution and solution issues. In the future, such patterning technique could be applied to a continuous, roll-to-roll, room-temperature processing over large-area, high-throughput and low-cost fabrication of full-polymer organic devices on flexible substrate, especially patterning OTFT backplane and organic polymer OLEDs for active-matrix OLED flexible displays.

     

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發行人:黃啟川/輯編輯委員:林烈全•王福山•黃建龍張萬權莊允中•李月修李肇升